Samsung Electronics chooses a new CEO for its semiconductor division as race for AI chips intensifies

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Samsung Electronics chooses a new CEO for its semiconductor division as race for AI chips intensifies
Samsung Electronics chooses a new CEO for its semiconductor division as race for AI chips intensifies

Young Hyun Jun will take over for Kyehyun Kyung, who will now head Samsung Advanced Institute of Technology and the future business division.

In an effort to take the lead in the battle for artificial intelligence chips, Samsung Electronics chose a new CEO for its semiconductor division on Tuesday.

Kyehyun Kyung, who will now lead Samsung Advanced Institute of Technology and the future business division, which is focused on finding new growth prospects, will be replaced by Young Hyun Jun.

According to Samsung Electronics, the company wants to “strengthen its competitiveness amid an uncertain global business environment.” Jun has led the company’s memory and battery manufacturing units for a long time.

Samsung and SK Hynix are engaged in a fierce rivalry to create the most cutting-edge memory chips available so that they can capitalize on the AI trend. The top three suppliers in the world, Samsung, SK Hynix, and Micron, presently control the majority of the memory chip market.

SK Hynix has been at the vanguard of high-bandwidth memory as it was Nvidia’s exclusive source of HBM3 chips, which are at the forefront of artificial intelligence computers. There are rumors that Nvidia is also looking at Samsung as a supplier.

“By 2025, we anticipate a sharper competition in high-bandwidth memory. SK Hynix is Nvidia’s only supplier for the HBM3 generation, and we think there were some quarters when SK Hynix and Samsung were behind in technology. Kazunori Ito, Morningstar’s director of equity research, said.

After being the first company in the industry to export samples of the newest chip, Samsung Electronics hopes to start mass producing the 12-layer HBM3E, SK Hynix’s most recent generation of high-bandwidth memory chips, in the second quarter.

It appears from this that Samsung is working rapidly to bridge the technological roadmap gap. We anticipate that this will enable all three of the major vendors to ship HBM3E to Nvidia, escalating the competition in terms of pricing, added Ito.

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